Notices for use of Hall effect ICs

Withstand voltage

Please use within the maximum rating and under the recommended operating conditions.
Because Hall effect ICs have polarity, take care to avoid reverse connection.
In particular, please take care to avoid high voltage [through][in][on] the element.
The element could be destroyed if the rated range should be exceeded.
Please take measures to protect against surge voltage and static charges in storage, handling, and mounting in a circuit.
Use Hall effect ICs in a manner that does not allow element to make contact with the driving circuit.

 

Lead forming (lead type, e.g., EW-500 series)

Please pay careful attention to the following precautions when carrying out lead forming for Hall effect ICs:

1.  Avoid application of external force on the molding part of the element.
2.  The force applied should be within the guaranteed range shown in Figure 1.
3.  Avoid application of a twisting force on the lead. 
                                            [Figure 1: Strength of terminal lead of a Hall effect IC] 
   

 

Soldering conditions

Although the reference conditions are shown as follows, please apply them only after careful examination and confirmation by the customer.

1.  Dipping (dipping entire element)
      When dipping is employed, processing in the condition within the temperature load shown in Figure 2 is recommended.
      Solder dipping should only be performed once. 
2.   Hand soldering (using soldering iron)
      Solder under thermal load at 260°C for less than 10 seconds, or 350°C for less than 3 seconds, without touching the body of the element.
      Hand soldering should be completed twice.
3.   Reflow
      When reflow is employed, processing within the temperature profile shown in Figure 3 is recommended.
       Reflow soldering should be completed twice.
4.    Solder flux
       Colophonium system solder flux is recommended.
       Use of an organic acid system, inorganic acid system or water-soluble fluxes should be avoided.
  Figure 2: Solder dipping condition                            Figure 3: Solder reflow condition


 

Cleaning

Please follow the procedure below when cleaning solder flux etc.

1. Cleaning agent                                            ... Ethanol and isopropyl alcohol
2. Temperature                                                ... 50°C or less
3. When ultrasonic cleaning is employed  ... Frequency: 45 kHz or less,
                                                                                Power output: 40 W/liter or less

 

Notices regarding storage environment

Please avoid direct sunlight when the products are stored, and keep them at normal room temperature and humidity as far as possible.
(Preferable storage condition is 5°C to 35°C and 40% to 85% RH.)

 

Notices for long-term storage

If the elements are stored for an extended time (two years or more) under the general storage conditions for semiconductors, the soldering characteristics of the lead terminal and the electrical characteristics could deteriorate; therefore, only use such elements after verifying their soldering and electrical characteristics, etc..
We recommend long-term storage in a nitrogen atmosphere.
The lead of the element will be oxidized by the oxygen in the atmosphere, and the soldering characteristics will deteriorate if the elements are stored in a normal atmosphere.

 

 

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