Packing

Packing Information

The packing design which can maintain the quality in spite of a transport method and the environment is being done.

AKM original packing

Compound semiconducting products adopt the packing specification corresponding to the product form based on long experience.
A large number of customers use them surely for a long time.

Corresponding to JEDEC standard

The packing specification of LSI parts in AKM are comply with the standard of JEDEC(J-STD-033C).
AKM will change inner label which apply to the products shipped from Oct 2016.

Label

A new label that complies with JDEC standard will be used on the production from Oct. 2016.

LabelCode
Description

Label

(P) P/N Customer Parts Number
(Q) Qty Quantity
(9D) D/C Date Code
(1T) SID Reel ID
MSL Moisture Sensitivity Level
PEAK Maximum reflow temperature
S/L Shelf Life
F/L Floor Life
SEAL DATE Packing date

Shipment Packing

The shipment packing type depends on MSL classification.

TypeTape / Tray / Tube
MSL (Moisture Sensitivity Level)11 *22A3
Moisture Barrier BagNoYesYesYesYes
DesiccantNoYesYesYesYes
HIC (Humidity Indicator Card)No
YesYesYes

* Several products adopt moisture-proof packing and include a desiccant.

MSL1
Non-Moisture-proof
Packing Type

step 1step 2step 3
Reel


Tray

MSL1
Moisture-proof
Packing Type

step 1step 2step 3
Reel

Tray
MSL2
MSL 2A
MSL 3
Moisture-proof
Packing Type

step 1step 2step 3
Reel

Tray


Page Top