The packing design which can maintain the quality in spite of a transport method and the environment is being done.
Compound semiconducting products adopt the packing specification corresponding to the product form based on long experience.
A large number of customers use them surely for a long time.
The packing specification of LSI parts in AKM are comply with the standard of JEDEC(J-STD-033C).
AKM will change inner label which apply to the products shipped from Oct 2016.
A new label that complies with JDEC standard will be used on the production from Oct. 2016.
Label | Code | Description |
(P) P/N | Customer Parts Number | |
(Q) Qty | Quantity | |
(9D) D/C | Date Code | |
(1T) SID | Reel ID | |
MSL | Moisture Sensitivity Level | |
PEAK | Maximum reflow temperature | |
S/L | Shelf Life | |
F/L | Floor Life | |
SEAL DATE | Packing date |
The shipment packing type depends on MSL classification.
Type | Tape / Tray / Tube | ||||
MSL (Moisture Sensitivity Level) | 1 | 1 * | 2 | 2A | 3 |
Moisture Barrier Bag | No | Yes | Yes | Yes | Yes |
Desiccant | No | Yes | Yes | Yes | Yes |
HIC (Humidity Indicator Card) | No | Yes | Yes | Yes |
* Several products adopt moisture-proof packing and include a desiccant.
MSL1 Non-Moisture-proof | Packing Type |
||
step 1 | step 2 | step 3 | |
Reel | |||
Tray | |||
MSL1 Moisture-proof | Packing Type |
||
step 1 | step 2 | step 3 | |
Reel | |||
Tray | |||
MSL2 MSL 2A MSL 3 Moisture-proof | Packing Type |
||
step 1 | step 2 | step 3 | |
Reel | |||
Tray |