Packing

Packing Information

The packing design which can maintain the quality in spite of a transport method and the environment is being done.

AKM original packing

Compound semiconducting products adopt the packing specification corresponding to the product form based on long experience.
A large number of customers use them surely for a long time.

Corresponding to JEDEC standard

The packing specification of LSI parts in AKM are comply with the standard of JEDEC(J-STD-033C).
AKM will change inner label which apply to the products shipped from Oct 2016.

Label

A new label that complies with JDEC standard will be used on the production from Oct. 2016.

Label	Code	Description
	(P) P/N	Customer Parts Number
	(Q) Qty	Quantity
	(9D) D/C	Date Code
	(1T) SID	Reel ID
	MSL	Moisture Sensitivity Level
	PEAK	Maximum reflow temperature
	S/L	Shelf Life
	F/L	Floor Life
	SEAL DATE	Packing date

Shipment Packing

The shipment packing type depends on MSL classification.

Type	Tape / Tray / Tube
MSL (Moisture Sensitivity Level)	1	1 *	2	2A	3
Moisture Barrier Bag	No	Yes	Yes	Yes	Yes
Desiccant	No	Yes	Yes	Yes	Yes
HIC (Humidity Indicator Card)	No		Yes	Yes	Yes

* Several products adopt moisture-proof packing and include a desiccant.

MSL1 Non-Moisture-proof	Packing Type
	step 1	step 2	step 3
Reel
Tray
MSL1 Moisture-proof	Packing Type
	step 1	step 2	step 3
Reel
Tray
MSL2 MSL 2A MSL 3 Moisture-proof	Packing Type
	step 1	step 2	step 3
Reel
Tray