Simplify Complex Audio Designs with a Single Chip

In modern automotive audio systems, the increasing number of audio sources has created challenges due to the limited number of audio interfaces available on SoCs (System-on-Chip). In addition, support for multiple clocks and different sampling rates has made system configurations increasingly complex.

The AK7700 and AK7701 integrate both Audio Hub functionality, which consolidates and controls multiple audio signals and clocks on a single chip, and DSP (Digital Signal Processor) functionality in compact 7.00 × 7.00 × 0.85 mm and 9.00 × 9.00 × 0.85 mm packages. By consolidating and managing multiple audio interfaces, these devices reduce the processing load on the SoC and help simplify its overall system architecture. In addition, the DSP’s low-latency audio processing supports applications such as In-Car Communication (ICC) and hands-free systems.

The AK7700 and AK7701, which support different numbers of audio input/output interfaces, are available, allowing customers to choose the most suitable devices based on their system requirements.

In addition, the intuitive no-code design tool streamlines audio processing design and tuning, helping reduce development time.

Mass production is scheduled to begin in December 2026 for the AK7700 and in February 2027 for the AK7701.